Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

Original languageEnglish (US)
Pages (from-to)312-327
Number of pages16
JournalInternational Journal of Materials and Product Technology
Volume37
Issue number3-4
DOIs
StatePublished - Feb 2010
Externally publishedYes

Keywords

  • Ball grid array
  • BGA
  • Design of experiment
  • Failure analysis
  • Manufacturing process
  • Solder joint

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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