Abstract
Run-to-run process control is traditionally applied to select processes. Through advances in process-engineering-friendly software tools, this can be used across wafer fabrication to maintain process repeatability automatically and compensate for upstream process variability, achieve better device yields and speeds, and greatly enhance factory productivity.
| Original language | English (US) |
|---|---|
| Journal | Solid State Technology |
| Volume | 42 |
| Issue number | 12 |
| State | Published - 1999 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Physics and Astronomy (miscellaneous)
- Condensed Matter Physics