Abstract

The recently emerged metallic-cavity nanolasers have opened a new phase of miniaturization of semiconductor lasers down to sub-wavelength scale. This new type of semiconductor lasers is suitable for many low-power applications due to its small size, tight optical confinement and good heat dissipation. However, there are major technical challenges in the fabrication of such nanolasers that must be overcome to make high-quality devices with high yield needed for practical applications. Here we will discuss several fabrication issues that are critical to the device performance. These issues, including device patterning, pillar etching, surface passivation and metal deposition, will determine both optical and electrical properties, especially the lifetime, threshold, and efficiency of a nanolaser.

Original languageEnglish (US)
Article number124002
JournalSemiconductor Science and Technology
Volume28
Issue number12
DOIs
StatePublished - Dec 2013

Fingerprint

Semiconductor lasers
injection
Semiconductor materials
Fabrication
cavities
fabrication
semiconductor lasers
Heat losses
Passivation
Etching
Electric properties
Optical properties
Metals
miniaturization
Wavelength
passivity
electrical properties
etching
cooling
optical properties

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Condensed Matter Physics

Cite this

Fabrication challenges of electrical injection metallic cavity semiconductor nanolasers. / Ding, K.; Ning, Cun-Zheng.

In: Semiconductor Science and Technology, Vol. 28, No. 12, 124002, 12.2013.

Research output: Contribution to journalArticle

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