Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures

Stefan Holzer, Rainer Minixhofer, Clemens Heitzinger, Johannes Fellner, Tibor Grasser, Siegfried Selberherr

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

An approach for determining higher order coefficients of the electrical and thermal conductivities for different materials is presented. The method is based on inverse modeling using three-dimensional transient electrothermal finite element simulations for electrothermal investigations of complex layered structures, for instance polycrystalline silicon (polysilicon) fuses or other multi-layered devices. The simulations are performed with a three-dimensional interconnect simulator, which is automatically configured and controlled by an optimization framework. Our method is intended to be applied to optimize devices with different material compositions and geometries as well as for achieving an optimum of speed and reliability.

Original languageEnglish (US)
Pages (from-to)805-810
Number of pages6
JournalMicroelectronics Journal
Volume35
Issue number10
DOIs
StatePublished - Oct 2004
Externally publishedYes

Fingerprint

fuses
Electric fuses
Polysilicon
simulators
Thermal conductivity
thermal conductivity
simulation
Simulators
electrical resistivity
optimization
Geometry
silicon
coefficients
geometry
Chemical analysis
Electric Conductivity

Keywords

  • Electro-thermal simulation
  • Parameter extraction
  • Polycrystalline silicon
  • Polyfuse
  • Polysilicon

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures. / Holzer, Stefan; Minixhofer, Rainer; Heitzinger, Clemens; Fellner, Johannes; Grasser, Tibor; Selberherr, Siegfried.

In: Microelectronics Journal, Vol. 35, No. 10, 10.2004, p. 805-810.

Research output: Contribution to journalArticle

Holzer, S, Minixhofer, R, Heitzinger, C, Fellner, J, Grasser, T & Selberherr, S 2004, 'Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures', Microelectronics Journal, vol. 35, no. 10, pp. 805-810. https://doi.org/10.1016/j.mejo.2004.06.011
Holzer, Stefan ; Minixhofer, Rainer ; Heitzinger, Clemens ; Fellner, Johannes ; Grasser, Tibor ; Selberherr, Siegfried. / Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures. In: Microelectronics Journal. 2004 ; Vol. 35, No. 10. pp. 805-810.
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