Abstract
An approach for determining higher order coefficients of the electrical and thermal conductivities for different materials is presented. The method is based on inverse modeling using three-dimensional transient electrothermal finite element simulations for electrothermal investigations of complex layered structures, for instance polycrystalline silicon (polysilicon) fuses or other multi-layered devices. The simulations are performed with a three-dimensional interconnect simulator, which is automatically configured and controlled by an optimization framework. Our method is intended to be applied to optimize devices with different material compositions and geometries as well as for achieving an optimum of speed and reliability.
Original language | English (US) |
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Pages (from-to) | 805-810 |
Number of pages | 6 |
Journal | Microelectronics Journal |
Volume | 35 |
Issue number | 10 |
DOIs | |
State | Published - Oct 2004 |
Externally published | Yes |
Keywords
- Electro-thermal simulation
- Parameter extraction
- Polycrystalline silicon
- Polyfuse
- Polysilicon
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering