TY - GEN
T1 - Evaluation of Single Event Effects in SRAM and RRAM Based Neuromorphic Computing System for Inference
AU - Ye, Zhilu
AU - Liu, Rui
AU - Barnaby, Hugh
AU - Yu, Shimeng
N1 - Funding Information:
This work was supported in part by DoD-DTRA under grant HDTRA1-17-1-0038.
Funding Information:
ACKNOWLEDGEMENT This work was supported in part by grant HDTRA1-17-1-0038.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/5/22
Y1 - 2019/5/22
N2 - In this work, single event effects (SEEs) are analyzed in SRAM- and RRAM-based neuromorphic computing systems. SPICE simulation is employed to model single event upset (SEU) at the array level. Then SEU effects are mapped to the weight pattern change of a multi-layer perceptron (MLP), a representative artificial neural network for MNIST handwritten digit recognition. Simulations show that the RRAM-based MLP has less susceptibility to SEEs compared with the SRAM architecture. Improvements to the SRAM-based MLP reliability may be achieved by lowering bit-width and enlarging network size.
AB - In this work, single event effects (SEEs) are analyzed in SRAM- and RRAM-based neuromorphic computing systems. SPICE simulation is employed to model single event upset (SEU) at the array level. Then SEU effects are mapped to the weight pattern change of a multi-layer perceptron (MLP), a representative artificial neural network for MNIST handwritten digit recognition. Simulations show that the RRAM-based MLP has less susceptibility to SEEs compared with the SRAM architecture. Improvements to the SRAM-based MLP reliability may be achieved by lowering bit-width and enlarging network size.
KW - Multi-layer perceptron
KW - Neuromorphic computing
KW - RRAM
KW - SRAM
KW - Single event upset
UR - http://www.scopus.com/inward/record.url?scp=85066732435&partnerID=8YFLogxK
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U2 - 10.1109/IRPS.2019.8720490
DO - 10.1109/IRPS.2019.8720490
M3 - Conference contribution
AN - SCOPUS:85066732435
T3 - IEEE International Reliability Physics Symposium Proceedings
BT - 2019 IEEE International Reliability Physics Symposium, IRPS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Reliability Physics Symposium, IRPS 2019
Y2 - 31 March 2019 through 4 April 2019
ER -