Evaluation of epoxy based nanodielectrics for high voltage outdoor insulation

G. Iyer, Ravi S Gorur, R. Richert, A. Krivda, L. E. Schmidt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Nano and micro based epoxy samples have been evaluated for predicting their electrical performance in outdoor high voltage insulation applications. Scanning electron microscopy (SEM) is used to evaluate the shape and the dispersion of the filler material. Space charge characterization and the role of the interface in these materials is evaluated using dielectric spectroscopy on these samples. The results of dielectric spectroscopy reveal the potential of improved electrical performance in terms of dielectric strength and tracking and erosion performance of the nano-filled samples as compared to the micro-filled counterparts. The uniform filler dispersion and the low loss tangent values have been used to theorize the improvement that can be expected from nano-composites in the field of outdoor insulation.

Original languageEnglish (US)
Title of host publicationConference Record of the 2010 IEEE International Symposium on Electrical Insulation, ISEI 2010
DOIs
StatePublished - Oct 8 2010
Externally publishedYes
Event2010 IEEE International Symposium on Electrical Insulation, ISEI 2010 - San Diego, CA, United States
Duration: Jun 6 2010Jun 9 2010

Publication series

NameConference Record of IEEE International Symposium on Electrical Insulation
ISSN (Print)0164-2006

Other

Other2010 IEEE International Symposium on Electrical Insulation, ISEI 2010
CountryUnited States
CitySan Diego, CA
Period6/6/106/9/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Iyer, G., Gorur, R. S., Richert, R., Krivda, A., & Schmidt, L. E. (2010). Evaluation of epoxy based nanodielectrics for high voltage outdoor insulation. In Conference Record of the 2010 IEEE International Symposium on Electrical Insulation, ISEI 2010 [5549743] (Conference Record of IEEE International Symposium on Electrical Insulation). https://doi.org/10.1109/ELINSL.2010.5549743