Evaluating nano composites for high voltage applications

G. Iyer; R. S. Gorur; A. Krivda

doi:10.1109/CEIDP.2012.6378844

Evaluating nano composites for high voltage applications

G. Iyer, R. S. Gorur, A. Krivda

Electrical, Computer, and Energy Engineering, School of (IAFSE-ECEE)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young's modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.

Original language	English (US)
Title of host publication	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Pages	569-572
Number of pages	4
DOIs	https://doi.org/10.1109/CEIDP.2012.6378844
State	Published - 2012
Event	2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012 - Montreal, QC, Canada Duration: Oct 14 2012 → Oct 17 2012

Other

Other	2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012
Country/Territory	Canada
City	Montreal, QC
Period	10/14/12 → 10/17/12

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/CEIDP.2012.6378844

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title = "Evaluating nano composites for high voltage applications",

abstract = "A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young's modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.",

author = "G. Iyer and Gorur, {R. S.} and A. Krivda",

year = "2012",

doi = "10.1109/CEIDP.2012.6378844",

language = "English (US)",

pages = "569--572",

booktitle = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",

note = "2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012 ; Conference date: 14-10-2012 Through 17-10-2012",

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TY - GEN

T1 - Evaluating nano composites for high voltage applications

AU - Iyer, G.

AU - Gorur, R. S.

AU - Krivda, A.

PY - 2012

Y1 - 2012

N2 - A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young's modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.

AB - A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young's modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.

UR - http://www.scopus.com/inward/record.url?scp=84872064050&partnerID=8YFLogxK

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U2 - 10.1109/CEIDP.2012.6378844

DO - 10.1109/CEIDP.2012.6378844

M3 - Conference contribution

AN - SCOPUS:84872064050

SP - 569

EP - 572

BT - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

T2 - 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012

Y2 - 14 October 2012 through 17 October 2012

ER -

Evaluating nano composites for high voltage applications

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