Evaluating nano composites for high voltage applications

G. Iyer, R. S. Gorur, A. Krivda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young's modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.

Original languageEnglish (US)
Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Pages569-572
Number of pages4
DOIs
StatePublished - 2012
Event2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012 - Montreal, QC, Canada
Duration: Oct 14 2012Oct 17 2012

Other

Other2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012
CountryCanada
CityMontreal, QC
Period10/14/1210/17/12

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Iyer, G., Gorur, R. S., & Krivda, A. (2012). Evaluating nano composites for high voltage applications. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 569-572). [6378844] https://doi.org/10.1109/CEIDP.2012.6378844