Abstract
Current aperture vertical electron transistor (CAVET) was successfully demonstrated by using Mg-implanted GaN as a current blocking layer for nonalloyed source contacts. A maximum source-drain current of 5.6 × 103 A/cm2 (corresponding to 0.22 A/mm of source) and an extrinsic transconductance (gm) of 54 mS/mm of source were achieved. Threshold voltage as high as 0.6 V was realized by CF4 plasma exposure for 10 min, increasing the transconductance of the device to 140 mS/mm of source. Thus, a normally off CAVET was demonstrated for the first time. The increase in gm by CF4 plasma exposure for a given bias was due to etching of the AlGaN barrier. The shift of threshold voltage and the gm varied directly with the time of exposure. There was no significant dispersion in these devices.
Original language | English (US) |
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Pages (from-to) | 543-545 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 29 |
Issue number | 6 |
DOIs | |
State | Published - Jun 2008 |
Externally published | Yes |
Keywords
- AlGaN/GaN
- Current aperture vertical electron transistor (CAVET)
- F plasma treatment
- Mg implanted
- Normally off
- Threshold voltage
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering