Enhanced Adhesion of Organic Layer/Film/Substrate Surfaces to Inorganic Layer/Film/Substrate Surfaces

Terry Alford (Inventor)

Research output: Patent

Abstract

This invention will change the chemical compositions in silicon wafers so that bonding between two wafers will be stronger. The result will also allow the adhesion of organic materials to inorganic material. This will also all enhanced adhesion between polymer and silicon. As a result, flexible electronics or bioelectronics or any application needing plastic with single crystal silicon devices can be achieved.
Original languageEnglish (US)
StatePublished - Nov 6 2003

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