Enhanced [111] preferred orientation of Ag thin film on amorphous SiO 2 by Cu addition

Yeongseok Zoo; Hauk Han; Terry Alford

doi:10.1557/proc-0990-b08-06

Enhanced [111] preferred orientation of Ag thin film on amorphous SiO ₂ by Cu addition

Yeongseok Zoo, Hauk Han, Terry Alford

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Small amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO₂ substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.

Original language	English (US)
Title of host publication	Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
Publisher	Materials Research Society
Pages	141-146
Number of pages	6
ISBN (Print)	9781558999503
DOIs	https://doi.org/10.1557/proc-0990-b08-06
State	Published - Jan 1 2007
Event	2007 MRS Spring Meeting - San Francisco, CA, United States Duration: Apr 9 2007 → Apr 13 2007

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	990
ISSN (Print)	0272-9172

Other

Other	2007 MRS Spring Meeting
Country/Territory	United States
City	San Francisco, CA
Period	4/9/07 → 4/13/07

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1557/proc-0990-b08-06

Cite this

Zoo, Y., Han, H., & Alford, T. (2007). Enhanced [111] preferred orientation of Ag thin film on amorphous SiO ₂ by Cu addition. In Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics (pp. 141-146). (Materials Research Society Symposium Proceedings; Vol. 990). Materials Research Society. https://doi.org/10.1557/proc-0990-b08-06

Enhanced [111] preferred orientation of Ag thin film on amorphous SiO ₂ by Cu addition. / Zoo, Yeongseok; Han, Hauk; Alford, Terry.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics. Materials Research Society, 2007. p. 141-146 (Materials Research Society Symposium Proceedings; Vol. 990).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zoo, Y, Han, H & Alford, T 2007, Enhanced [111] preferred orientation of Ag thin film on amorphous SiO ₂ by Cu addition. in Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics. Materials Research Society Symposium Proceedings, vol. 990, Materials Research Society, pp. 141-146, 2007 MRS Spring Meeting, San Francisco, CA, United States, 4/9/07. https://doi.org/10.1557/proc-0990-b08-06

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abstract = "Small amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO2 substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.",

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