Enhanced [111] preferred orientation of Ag thin film on amorphous SiO 2 by Cu addition

Yeongseok Zoo, Hauk Han, Terry Alford

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Small amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO2 substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.

Original languageEnglish (US)
Title of host publicationMaterials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
PublisherMaterials Research Society
Pages141-146
Number of pages6
ISBN (Print)9781558999503
DOIs
StatePublished - Jan 1 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
Volume990
ISSN (Print)0272-9172

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/9/074/13/07

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Zoo, Y., Han, H., & Alford, T. (2007). Enhanced [111] preferred orientation of Ag thin film on amorphous SiO 2 by Cu addition. In Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics (pp. 141-146). (Materials Research Society Symposium Proceedings; Vol. 990). Materials Research Society. https://doi.org/10.1557/proc-0990-b08-06