Encapsulation of silver via nitridation of Ag/Ti bilayer structures

Y. L. Zou, Terry Alford, D. Adams, T. Laursen, K. N. Tu, R. Morton, S. S. Lau

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Ag/Ti bilayer films deposited on silicon dioxide substrates were annealed in ammonia ambient in the temperature range of 400 - 600 °C. Rutherford backscattering spectrometry (RBS) and Auger electron spectroscopy (AES) have shown that Ti segregates to both the surface to form a TiN(O) layer and to the Ti/SiO 2 interface to form a Ti-oxide/Ti-silicide bilayer. The annealed bilayer structure had minimal Ti accumulations in Ag. Resistivity values of approximately 2 μΩ-cm were obtained in encapsulated Ag bilayer films, which are comparable to that of the as-deposited. X-ray analysis confirmed the absence of intermetallic phase transformation.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsS. Coffa, A. Polman, R.N. Schwartz
PublisherMaterials Research Society
Pages355-360
Number of pages6
Volume427
StatePublished - 1996
EventProceedings of the 1996 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 8 1996Apr 12 1996

Other

OtherProceedings of the 1996 MRS Spring Symposium
CitySan Francisco, CA, USA
Period4/8/964/12/96

Fingerprint

Nitridation
Encapsulation
Silver
X ray analysis
Rutherford backscattering spectroscopy
Auger electron spectroscopy
Ammonia
Silicon Dioxide
Oxides
Spectrometry
Intermetallics
Phase transitions
Silica
Substrates
Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Zou, Y. L., Alford, T., Adams, D., Laursen, T., Tu, K. N., Morton, R., & Lau, S. S. (1996). Encapsulation of silver via nitridation of Ag/Ti bilayer structures. In S. Coffa, A. Polman, & R. N. Schwartz (Eds.), Materials Research Society Symposium - Proceedings (Vol. 427, pp. 355-360). Materials Research Society.

Encapsulation of silver via nitridation of Ag/Ti bilayer structures. / Zou, Y. L.; Alford, Terry; Adams, D.; Laursen, T.; Tu, K. N.; Morton, R.; Lau, S. S.

Materials Research Society Symposium - Proceedings. ed. / S. Coffa; A. Polman; R.N. Schwartz. Vol. 427 Materials Research Society, 1996. p. 355-360.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zou, YL, Alford, T, Adams, D, Laursen, T, Tu, KN, Morton, R & Lau, SS 1996, Encapsulation of silver via nitridation of Ag/Ti bilayer structures. in S Coffa, A Polman & RN Schwartz (eds), Materials Research Society Symposium - Proceedings. vol. 427, Materials Research Society, pp. 355-360, Proceedings of the 1996 MRS Spring Symposium, San Francisco, CA, USA, 4/8/96.
Zou YL, Alford T, Adams D, Laursen T, Tu KN, Morton R et al. Encapsulation of silver via nitridation of Ag/Ti bilayer structures. In Coffa S, Polman A, Schwartz RN, editors, Materials Research Society Symposium - Proceedings. Vol. 427. Materials Research Society. 1996. p. 355-360
Zou, Y. L. ; Alford, Terry ; Adams, D. ; Laursen, T. ; Tu, K. N. ; Morton, R. ; Lau, S. S. / Encapsulation of silver via nitridation of Ag/Ti bilayer structures. Materials Research Society Symposium - Proceedings. editor / S. Coffa ; A. Polman ; R.N. Schwartz. Vol. 427 Materials Research Society, 1996. pp. 355-360
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