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Elimination of Titanium Nitride Cracking Using Stress Alleviating Ti Buffer Layers
Terry Alford
(Inventor)
Arizona State University
Research output
:
Patent
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Dive into the research topics of 'Elimination of Titanium Nitride Cracking Using Stress Alleviating Ti Buffer Layers'. Together they form a unique fingerprint.
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Physics & Astronomy
titanium nitrides
100%
elimination
81%
buffers
69%
integrated circuits
19%
residual stress
19%
silver
16%
cracks
15%
copper
14%