Electronic transport mechanism in amorphous tetrahedrally-coordinated carbon films

J. P. Sullivan, T. A. Friedmann, R. G. Dunn, Ellen Stechel, P. A. Schultz, M. P. Siegal, N. Missert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Scopus citations

Abstract

The electronic transport mechanism is tetrahedrally-coordinated amorphous carbon was investigated using measurements of stress relaxation, thermal evolution of electrical conductivity, and temperature-dependent conductivity measurements. Stress relaxation measurements were used to determine the change in 3-fold coordinated carbon concentration, and the electrical conductivity was correlated to this change. It was found that the conductivity was exponentially proportional to the change in 3-fold concentration, indicating a tunneling or hopping transport mechanism. It was also found that the activation energy for transport decreased with increasing anneal temperature. The decrease in activation energy was responsible for the observed increase in electrical conductivity. A model is described wherein the transport in this material is described by thermally activated conduction along 3-fold linkages or chains with variable range and variable orientation hopping. Thermal annealing leads to chain ripening and a reduction in the activation energy for transport.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
PublisherMRS
Pages97-102
Number of pages6
Volume498
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 MRS Fall Symposium - Boston, MA, USA
Duration: Dec 1 1997Dec 4 1997

Other

OtherProceedings of the 1997 MRS Fall Symposium
CityBoston, MA, USA
Period12/1/9712/4/97

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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    Sullivan, J. P., Friedmann, T. A., Dunn, R. G., Stechel, E., Schultz, P. A., Siegal, M. P., & Missert, N. (1997). Electronic transport mechanism in amorphous tetrahedrally-coordinated carbon films. In Materials Research Society Symposium - Proceedings (Vol. 498, pp. 97-102). MRS.