Abstract

In this work we present preliminary results demonstrating the influence of electrical double layer overlap on the electromigration of polystyrene beads (PSB) through an array of 25 cylindrical nanopores. Each of the cylindrical nanopores of the array used in this study is 360nm long with a diameter of 90nm. We observe frequent Coulter events for solutions of higher ionic strength and absence of Coulter events at low ionic strength solution. At higher ionic strengths, the electric double layers in the nanopore are thin and ion transport through the nanopore follows the bulk behavior of the ionic solution. For solutions of lower ionic strength, the electric double layers are comparable to the nanopore dimensions and start to overlap, suggesting surface charge interaction with the polystyrene beads that pass through the nanopore. The work continues towards detailed statistical analysis of the characteristic events observed for different concentrations.

Original languageEnglish (US)
Title of host publicationASME International Mechanical Engineering Congress and Exposition, Proceedings
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages257-262
Number of pages6
Volume2
ISBN (Print)9780791843758
DOIs
StatePublished - 2010
Event2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States
Duration: Nov 13 2009Nov 19 2009

Other

Other2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
CountryUnited States
CityLake Buena Vista, FL
Period11/13/0911/19/09

Fingerprint

Nanopores
Electromigration
Ionic strength
Polystyrenes
Silicon
Surface charge
Statistical methods
Ions

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Joshi, P., Mathew, T., Petrossian, L., Prasad, S., Goryll, M., Spanias, A., & Thornton, T. (2010). Electromigration of charged polystyrene beads through silicon nanopores filled with low ionic strength solutions. In ASME International Mechanical Engineering Congress and Exposition, Proceedings (Vol. 2, pp. 257-262). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2009-11428

Electromigration of charged polystyrene beads through silicon nanopores filled with low ionic strength solutions. / Joshi, Punarvasu; Mathew, Trupthi; Petrossian, Leo; Prasad, Shalini; Goryll, Michael; Spanias, Andreas; Thornton, Trevor.

ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 2 American Society of Mechanical Engineers (ASME), 2010. p. 257-262.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Joshi, P, Mathew, T, Petrossian, L, Prasad, S, Goryll, M, Spanias, A & Thornton, T 2010, Electromigration of charged polystyrene beads through silicon nanopores filled with low ionic strength solutions. in ASME International Mechanical Engineering Congress and Exposition, Proceedings. vol. 2, American Society of Mechanical Engineers (ASME), pp. 257-262, 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009, Lake Buena Vista, FL, United States, 11/13/09. https://doi.org/10.1115/IMECE2009-11428
Joshi P, Mathew T, Petrossian L, Prasad S, Goryll M, Spanias A et al. Electromigration of charged polystyrene beads through silicon nanopores filled with low ionic strength solutions. In ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 2. American Society of Mechanical Engineers (ASME). 2010. p. 257-262 https://doi.org/10.1115/IMECE2009-11428
Joshi, Punarvasu ; Mathew, Trupthi ; Petrossian, Leo ; Prasad, Shalini ; Goryll, Michael ; Spanias, Andreas ; Thornton, Trevor. / Electromigration of charged polystyrene beads through silicon nanopores filled with low ionic strength solutions. ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 2 American Society of Mechanical Engineers (ASME), 2010. pp. 257-262
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