Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD)

J. C E Mertens, A. Kirubanandham, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

29 Scopus citations

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Engineering & Materials Science

Chemical Compounds