Electrically conductive adhesive (ECA) processing for shingled modules analyzed by x-ray imaging

Barry Hartweg, Kathryn Fisher, Zachary Holman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electrically conductive adhesives (ECAs) are being used in several different PV module architectures, including shingled modules. Presently, there is limited available literature on the failure mechanisms of ECAs. X-ray imaging techniques can image a wider region than that of sample extraction for SEM imaging, while still retaining resolutions down to 0.5 µm/pixel. X-ray projections have been used to study the effect of different ECA application methods and curing conditions on the ECA in a shingled mini-module. It was found that lamination does not affect the ECA, if it has already been cured. Additionally, the cell lay-up step in the shingled module fabrication was found to be the primary cause of voids in the ECA layer.

Original languageEnglish (US)
Title of host publication2020 47th IEEE Photovoltaic Specialists Conference, PVSC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages340-341
Number of pages2
ISBN (Electronic)9781728161150
DOIs
StatePublished - Jun 14 2020
Event47th IEEE Photovoltaic Specialists Conference, PVSC 2020 - Calgary, Canada
Duration: Jun 15 2020Aug 21 2020

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
Volume2020-June
ISSN (Print)0160-8371

Conference

Conference47th IEEE Photovoltaic Specialists Conference, PVSC 2020
Country/TerritoryCanada
CityCalgary
Period6/15/208/21/20

Keywords

  • ECA
  • shingled module
  • x-ray imaging

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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