Abstract
Two defect types are identified in the buried oxide of low dose SIMOX: conductive silicon paths through the buried oxide (pipes) and silicon precipitates in the buried oxide. Both types are caused by the same general mechanism: the tendency of the Si-SiO2 system at high temperature to separate into regions of Si and SiO2 rather than forming SiOx. Below an oxygen dose of approximately 4×1017 cm-2, the buried oxide is not continuous, and as the dose is lowered the implanted region becomes a layer of SiO2 precipitates. Above the dose of approximately 4×1017 cm-2, the buried oxide is continuous, but Si precipitates approximately 50 nm thick are present in the oxide.
Original language | English (US) |
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Title of host publication | IEEE International SOI Conference |
Editors | Anon |
Place of Publication | Piscataway, NJ, United States |
Publisher | IEEE |
Pages | 167-168 |
Number of pages | 2 |
State | Published - 1998 |
Externally published | Yes |
Event | Proceedings of the 1998 IEEE International SOI Conference - Stuart, FL, USA Duration: Oct 5 1998 → Oct 8 1998 |
Other
Other | Proceedings of the 1998 IEEE International SOI Conference |
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City | Stuart, FL, USA |
Period | 10/5/98 → 10/8/98 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering