Abstract
We reported selenium passivation of silicon (001) surface and showed the ohmic nature of the interface between magnesium and selenium-passivated n -type silicon (001). In this paper, we present a detailed study on the thermal stability of this interface. Magnesium contacts on selenium-passivated silicon (001) are annealed from 200°C to 500°C at an interval of 50°C and then characterized by current-voltage measurements. Schottky barrier heights of the contacts are measured by capacitance-voltage and activation-energy methods. Schottky behaviour sets in only when the interface is subjected to annealing above 375°C. On the contrary, magnesium contacts on bare silicon (001) turn from ohmic to Schottky at much lower temperatures. The temperature difference is 50-150°C. We deduce that selenium passivation suppresses silicidation between magnesium and silicon, because it reduces the surface reactivity of silicon by eliminating dangling bonds and relaxing strained bonds.
Original language | English (US) |
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Pages (from-to) | 719-727 |
Number of pages | 9 |
Journal | International Journal of Electronics |
Volume | 92 |
Issue number | 12 |
DOIs | |
State | Published - Dec 2005 |
Externally published | Yes |
Keywords
- Dangling bond
- Interface state
- Schottky barrier
- Selenium
- Silicon
- Surface passivation
- Surface state
ASJC Scopus subject areas
- Electrical and Electronic Engineering