Effect of voids on thermo-mechanical durability of Pb-free BGA solder joints: Modeling and simulation

Leila Jannesari Ladani, Abhijit Dasgupta

Research output: Contribution to conferencePaperpeer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'Effect of voids on thermo-mechanical durability of Pb-free BGA solder joints: Modeling and simulation'. Together they form a unique fingerprint.

Engineering & Materials Science