Abstract

Transient annealing effects on the grain size, structure and morphology of B and As implanted films of polycrystalline silicon were determined by transmission electron microscopy. Originally, grains had a bimodal distribution of smaller equiaxed grains and larger columnar grains. The growth of both types of grains was described with a modified model for interfacial energy driven grain growth. Bend contours in annealed unimplanted films were not present in annealed ion implanted films due to formation of a cellular network structure in the grains.

Original languageEnglish (US)
Title of host publicationInstitute of Physics Conference Series
Pages105-110
Number of pages6
Edition76
StatePublished - 1985

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Crystal microstructure
Grain growth
Polysilicon
Annealing
Interfacial energy
Transmission electron microscopy
Ions

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Krause, S., Wilson, S. R., Paulson, W. M., & Gregory, R. B. (1985). EFFECT OF TRANSIENT ANNEALING ON GRAIN GROWTH AND STRUCTURE OF POLYCRYSTALLINE SILICON FILMS. In Institute of Physics Conference Series (76 ed., pp. 105-110)

EFFECT OF TRANSIENT ANNEALING ON GRAIN GROWTH AND STRUCTURE OF POLYCRYSTALLINE SILICON FILMS. / Krause, Stephen; Wilson, S. R.; Paulson, W. M.; Gregory, R. B.

Institute of Physics Conference Series. 76. ed. 1985. p. 105-110.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Krause, S, Wilson, SR, Paulson, WM & Gregory, RB 1985, EFFECT OF TRANSIENT ANNEALING ON GRAIN GROWTH AND STRUCTURE OF POLYCRYSTALLINE SILICON FILMS. in Institute of Physics Conference Series. 76 edn, pp. 105-110.
Krause S, Wilson SR, Paulson WM, Gregory RB. EFFECT OF TRANSIENT ANNEALING ON GRAIN GROWTH AND STRUCTURE OF POLYCRYSTALLINE SILICON FILMS. In Institute of Physics Conference Series. 76 ed. 1985. p. 105-110
Krause, Stephen ; Wilson, S. R. ; Paulson, W. M. ; Gregory, R. B. / EFFECT OF TRANSIENT ANNEALING ON GRAIN GROWTH AND STRUCTURE OF POLYCRYSTALLINE SILICON FILMS. Institute of Physics Conference Series. 76. ed. 1985. pp. 105-110
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