Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Fatigue tests were performed on pure copper polycrystals with a crystallographic texture different from that produced by 'standard' thermomechanical treatments, which emphasize multi-slip 〈111〉-〈100〉 textures. The texture along the loading axis deviated by 10-15° from these two poles for the samples used here. The experiments were initiated by ramp loading as a mechanical pretreatment and the cyclic stress-strain curve (CSSC) was established by step tests using enough cycles at each step to insure saturation. Under these conditions, a plateau was observed in the CSSC at an appropriate stress level and in a reproducible fashion.