Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Pedro Peralta, A. Czapka, K. Obergfell, L. Lianes, C. Laird, T. E. Mitchell

Research output: Contribution to journalArticle

6 Scopus citations

Abstract

Fatigue tests were performed on pure copper polycrystals with a crystallographic texture different from that produced by 'standard' thermomechanical treatments, which emphasize multi-slip 〈111〉-〈100〉 textures. The texture along the loading axis deviated by 10-15° from these two poles for the samples used here. The experiments were initiated by ramp loading as a mechanical pretreatment and the cyclic stress-strain curve (CSSC) was established by step tests using enough cycles at each step to insure saturation. Under these conditions, a plateau was observed in the CSSC at an appropriate stress level and in a reproducible fashion.

Original languageEnglish (US)
Pages (from-to)349-353
Number of pages5
JournalMaterials Science and Engineering A
Volume270
Issue number2
DOIs
StatePublished - Sep 30 1999

Keywords

  • Copper polycrystals
  • Fatigue tests
  • Stress-strain curve

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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