Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Pedro Peralta, A. Czapka, K. Obergfell, L. Lianes, C. Laird, T. E. Mitchell

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Fatigue tests were performed on pure copper polycrystals with a crystallographic texture different from that produced by 'standard' thermomechanical treatments, which emphasize multi-slip 〈111〉-〈100〉 textures. The texture along the loading axis deviated by 10-15° from these two poles for the samples used here. The experiments were initiated by ramp loading as a mechanical pretreatment and the cyclic stress-strain curve (CSSC) was established by step tests using enough cycles at each step to insure saturation. Under these conditions, a plateau was observed in the CSSC at an appropriate stress level and in a reproducible fashion.

Original languageEnglish (US)
Pages (from-to)349-353
Number of pages5
JournalMaterials Science and Engineering A
Volume270
Issue number2
StatePublished - Sep 30 1999

Fingerprint

Polycrystals
polycrystals
Copper
textures
Textures
Stress-strain curves
copper
Testing
thermomechanical treatment
Thermomechanical treatment
fatigue tests
curves
ramps
pretreatment
Poles
plateaus
slip
poles
Fatigue of materials
saturation

Keywords

  • Copper polycrystals
  • Fatigue tests
  • Stress-strain curve

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals. / Peralta, Pedro; Czapka, A.; Obergfell, K.; Lianes, L.; Laird, C.; Mitchell, T. E.

In: Materials Science and Engineering A, Vol. 270, No. 2, 30.09.1999, p. 349-353.

Research output: Contribution to journalArticle

Peralta, Pedro ; Czapka, A. ; Obergfell, K. ; Lianes, L. ; Laird, C. ; Mitchell, T. E. / Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals. In: Materials Science and Engineering A. 1999 ; Vol. 270, No. 2. pp. 349-353.
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AU - Mitchell, T. E.

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