Effect of selected manufacturing variabiles on reliability of lead free solder joints

Leila Jannesari Ladani, Abhijit Dasgupta, Idelcio Cardoso, Eduardo Monlevade

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the durability of lead free solder joints. An experiment was designed to systematically vary the reflow and printing process variables in order to fabricate error-seeded test assemblies. The error-seeded samples were then inspected visually and with x-rays, to identify different types of defects, and tested for electrical performance. The specimens were put under accelerated thermal cycling test to characterize the durability of specimens and to study the effect of each manufacturing variable on the durability of solder joints. Thus, the response variable for the design of experiments is the thermal cycling durability of the solder joints. Pre-test micro-structural analysis shows that specimens produced under inadequate reflow profiles suffer from insufficient wetting and insufficient intermetallic formation. Statistical analysis of the response variable shows that waiting time, heating ramp, peak temperature and cooling rate have non-linear effects on the response variable. Two variables, in particular (the heating ramp time and the waiting time), appear to have optimum values within the ranges investigated.

Original languageEnglish (US)
Title of host publicationProceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)0791837904, 9780791837900
StatePublished - 2006
Externally publishedYes
Event2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States
Duration: Nov 5 2006Nov 10 2006

Publication series

NameAmerican Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
ISSN (Print)1071-6947

Other

Other2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
CountryUnited States
CityChicago, IL
Period11/5/0611/10/06

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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