Effect of joint size on microstructure and growth kinetics of intermetallic compounds in solid-liquid interdiffusion Sn3.5Ag/ cu-substrate solder joints

Engineering & Materials Science

• Interdiffusion (solids) 100%
• Growth kinetics 81%
• Intermetallics 59%
• Soldering alloys 54%
• Substrates 39%
• Microstructure 37%
• Liquids 37%
• Soldering 24%
• Rate constants 17%
• Surface chemistry 9%
• X-Ray Emission Spectrometry 9%
• Eutectics 7%
• Activation energy 7%
• Temperature 5%
• Scanning electron microscopy 5%
• Experiments 2%

Chemical Compounds

• Solder 69%
• Intermetallic Compound 59%
• Soldering 38%
• Microstructure 37%
• Rate Constant 12%
• Time 10%
• Eutectics 9%
• Energy Dispersive X-Ray Spectroscopy 8%
• Surface Chemistry 8%
• Reaction Activation Energy 6%
• Scanning Electron Microscopy 5%
• Pressure 5%