Effect of design variables on voids and thermal performance of QFN packages

Farbod Askari, Leila Jannesari Ladani, Abhijit Dasgupta, Matti Rahko, Jussi Sarkka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and non-destructive failure analysis techniques. The effect of design variables on different types of defects such as voids, and taper were evaluated. This study showed that stencil aperture size influences void area percentage the most in comparison with other design variables. An optimal stencil configuration was proposed based on void area fraction calculations. A 2-D steady-state finite element analysis was then conducted to parametrically evaluate the effect of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction.

Original languageEnglish (US)
Title of host publication2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Pages705-712
Number of pages8
DOIs
StatePublished - 2007
Externally publishedYes
Event2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007 - Vancouver, BC, Canada
Duration: Jul 8 2007Jul 12 2007

Publication series

Name2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Volume2

Conference

Conference2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
CountryCanada
CityVancouver, BC
Period7/8/077/12/07

Keywords

  • FEA
  • Parametric studies
  • QFN
  • Solder voids
  • Stencil design
  • Thermal performance
  • Thermal vias

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics

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