Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Jason J. Williams, Irene Lujan Regalado, Leo Liu, Shailesh Joshi, Nikhilesh Chawla

Abstract

X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

Original languageEnglish (US)
Pages (from-to)241-244
Number of pages4
JournalJournal of Electronic Materials
Volume49
Issue number1
DOIs
Publication statusPublished - Jan 1 2020

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Keywords

  • DBC
  • power module
  • Sintered nano-silver paste
  • thermal cycling
  • warping
  • x-ray tomography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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