Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Jason J. Williams, Irene Lujan Regalado, Leo Liu, Shailesh Joshi, Nikhilesh Chawla

Research output: Contribution to journalArticle

Abstract

X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

Original languageEnglish (US)
Pages (from-to)241-244
Number of pages4
JournalJournal of Electronic Materials
Volume49
Issue number1
DOIs
StatePublished - Jan 1 2020

Fingerprint

Thermal cycling
Silver
flexibility
silver
damage
X rays
cycles
thermal cycling tests
x rays
flexing
Silicon
Ointments
Tomography
Copper
sintering
Sintering
tomography
copper
silicon
Substrates

Keywords

  • DBC
  • power module
  • Sintered nano-silver paste
  • thermal cycling
  • warping
  • x-ray tomography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography. / Williams, Jason J.; Regalado, Irene Lujan; Liu, Leo; Joshi, Shailesh; Chawla, Nikhilesh.

In: Journal of Electronic Materials, Vol. 49, No. 1, 01.01.2020, p. 241-244.

Research output: Contribution to journalArticle

Williams, Jason J. ; Regalado, Irene Lujan ; Liu, Leo ; Joshi, Shailesh ; Chawla, Nikhilesh. / Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography. In: Journal of Electronic Materials. 2020 ; Vol. 49, No. 1. pp. 241-244.
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