Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Jason J. Williams; Irene Lujan Regalado; Leo Liu; Shailesh Joshi; Nikhilesh Chawla

doi:10.1007/s11664-019-07461-7

Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Jason J. Williams, Irene Lujan Regalado, Leo Liu, Shailesh Joshi, Nikhilesh Chawla

Engineering, Ira A. Fulton Schools of (IAFSE)

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

Original language	English (US)
Pages (from-to)	241-244
Number of pages	4
Journal	Journal of Electronic Materials
Volume	49
Issue number	1
DOIs	https://doi.org/10.1007/s11664-019-07461-7
State	Published - Jan 1 2020

Keywords

DBC
Sintered nano-silver paste
power module
thermal cycling
warping
x-ray tomography

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-019-07461-7

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title = "Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography",

abstract = "X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.",

keywords = "DBC, Sintered nano-silver paste, power module, thermal cycling, warping, x-ray tomography",

author = "Williams, {Jason J.} and Regalado, {Irene Lujan} and Leo Liu and Shailesh Joshi and Nikhilesh Chawla",

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AU - Joshi, Shailesh

AU - Chawla, Nikhilesh

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AB - X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

KW - DBC

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KW - power module

KW - thermal cycling

KW - warping

KW - x-ray tomography

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Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Abstract

Keywords

ASJC Scopus subject areas

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