Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids

William Evans, Ravi Prasher, Jacob Fish, Paul Meakin, Patrick Phelan, Pawel Keblinski

Research output: Contribution to journalArticle

319 Scopus citations

Abstract

We analyzed the role of aggregation and interfacial thermal resistance on the effective thermal conductivity of nanofluids and nanocomposites. We found that the thermal conductivity of nanofluids and nanocomposites can be significantly enhanced by the aggregation of nanoparticles into clusters. The value of the thermal conductivity enhancement is determined by the cluster morphology, filler conductivity and interfacial thermal resistance. We also compared thermal conductivity enhancement due to aggregation with that associated with high-aspect ratio fillers, including fibers and plates.

Original languageEnglish (US)
Pages (from-to)1431-1438
Number of pages8
JournalInternational Journal of Heat and Mass Transfer
Volume51
Issue number5-6
DOIs
StatePublished - Mar 1 2008

Keywords

  • Aggregation
  • Homogenization model
  • Interfacial thermal resistance
  • Monte Carlo simulation
  • Nanoparticles
  • Thermal conductivity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Fingerprint Dive into the research topics of 'Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids'. Together they form a unique fingerprint.

  • Cite this