Dynamics of the onset of damage in metals under shock loading

A. C. Koskelo, S. R. Greenfield, D. L. Paisley, K. J. McClellan, D. D. Byler, R. M. Dickerson, S. N. Luo, D. C. Swift, D. L. Tonks, Pedro Peralta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

This paper presents results on the dynamics of damage in copper under incipient spall conditions for multicrystalline specimens. Specimens were annealed from polycrystalline material to reduce the number of grain boundaries the shock wave traverses in passing through the specimen. The specimens incorporated unique fiducials that permit accurate correlation of pre-shot characterization of the grain orientations, grain size etc. with the location of the dynamic diagnostics and with post-shot metallography. The dynamic diagnostics - Transient Imaging Displacement Interferometry (TIDI), point VISAR, line VISAR - were all precisely aligned on the specimen surface to view regions of interest revealed in the pre-shot characterization. Initial analyses demonstrate the wealth of information obtained from this experimental approach. Examples include observation that regions in the surface micro structure most likely to be damaged based on pre-shot characterization show some of the largest displacements during the shock-loading. Post-shot microscopy shows damage in the same places. Another observation is there appears to be localized plastic deformation that occurs during the first compression wave which then remains and evolves through several cycles of compression and release from the spall plane.

Original languageEnglish (US)
Title of host publicationShock Compression of Condensed Matter - 2007
Subtitle of host publicationProceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2007 APS SCCM
Pages557-560
Number of pages4
DOIs
StatePublished - 2007
Event15th Biennial International Conference of the APS Topical Group on Shock Compression of Condensed Matter, SCCM 2007 - Waikoloa, HI, United States
Duration: Jun 24 2007Jun 29 2007

Publication series

NameAIP Conference Proceedings
Volume955
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other15th Biennial International Conference of the APS Topical Group on Shock Compression of Condensed Matter, SCCM 2007
CountryUnited States
CityWaikoloa, HI
Period6/24/076/29/07

Keywords

  • Copper
  • Ductile fracture
  • Spall
  • TIDI
  • TIM

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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