Dynamics of Crack Propagation during Silicon Spalling

Pablo Guimera Coll, Rico MEIER, Mariana Bertoni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Spalling has been proposed as a promising kerfless technique for slicing thin silicon wafers and thus double the yield of a silicon ingot. The main challenge of spalling is to control the roughness and thickness variation of the spalled wafers, that can be as high as 100% of the wafer thickness. We have shown that these thickness variations are largely influenced by the interaction of the crack front with reflected waves at the edges and the stress field applied at the crack tip. In this paper, we provide the necessary information to fully understand the origin of the surface roughness caused by the interaction of the reflected waves with the crack front. These new insights of the crack dynamics can pave the way to attain full control on the surface quality of the spalled wafer.

Original languageEnglish (US)
Title of host publication2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2537-2539
Number of pages3
ISBN (Electronic)9781538685297
DOIs
StatePublished - Nov 26 2018
Event7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States
Duration: Jun 10 2018Jun 15 2018

Other

Other7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
CountryUnited States
CityWaikoloa Village
Period6/10/186/15/18

Fingerprint

Spalling
Silicon
Crack propagation
Cracks
Surface roughness
Ingots
Silicon wafers
Crack tips
Surface properties

Keywords

  • crack dynamics
  • crack propagation
  • kerfless
  • reflected waves
  • silicon
  • Spalling

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Coll, P. G., MEIER, R., & Bertoni, M. (2018). Dynamics of Crack Propagation during Silicon Spalling. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC (pp. 2537-2539). [8548314] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2018.8548314

Dynamics of Crack Propagation during Silicon Spalling. / Coll, Pablo Guimera; MEIER, Rico; Bertoni, Mariana.

2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. p. 2537-2539 8548314.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Coll, PG, MEIER, R & Bertoni, M 2018, Dynamics of Crack Propagation during Silicon Spalling. in 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC., 8548314, Institute of Electrical and Electronics Engineers Inc., pp. 2537-2539, 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018, Waikoloa Village, United States, 6/10/18. https://doi.org/10.1109/PVSC.2018.8548314
Coll PG, MEIER R, Bertoni M. Dynamics of Crack Propagation during Silicon Spalling. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc. 2018. p. 2537-2539. 8548314 https://doi.org/10.1109/PVSC.2018.8548314
Coll, Pablo Guimera ; MEIER, Rico ; Bertoni, Mariana. / Dynamics of Crack Propagation during Silicon Spalling. 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 2537-2539
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