Dynamics of Crack Propagation during Silicon Spalling

Pablo Guimera Coll; Rico MEIER; Mariana Bertoni

doi:10.1109/PVSC.2018.8548314

Dynamics of Crack Propagation during Silicon Spalling

Pablo Guimera Coll, Rico MEIER, Mariana Bertoni

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

Spalling has been proposed as a promising kerfless technique for slicing thin silicon wafers and thus double the yield of a silicon ingot. The main challenge of spalling is to control the roughness and thickness variation of the spalled wafers, that can be as high as 100% of the wafer thickness. We have shown that these thickness variations are largely influenced by the interaction of the crack front with reflected waves at the edges and the stress field applied at the crack tip. In this paper, we provide the necessary information to fully understand the origin of the surface roughness caused by the interaction of the reflected waves with the crack front. These new insights of the crack dynamics can pave the way to attain full control on the surface quality of the spalled wafer.

Original language	English (US)
Title of host publication	2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2537-2539
Number of pages	3
ISBN (Electronic)	9781538685297
DOIs	https://doi.org/10.1109/PVSC.2018.8548314
State	Published - Nov 26 2018
Event	7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States Duration: Jun 10 2018 → Jun 15 2018

Other

Other	7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
Country/Territory	United States
City	Waikoloa Village
Period	6/10/18 → 6/15/18

Keywords

crack dynamics
crack propagation
kerfless
reflected waves
silicon
Spalling

ASJC Scopus subject areas

Energy Engineering and Power Technology
Renewable Energy, Sustainability and the Environment
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/PVSC.2018.8548314

Cite this

Coll, P. G., MEIER, R., & Bertoni, M. (2018). Dynamics of Crack Propagation during Silicon Spalling. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC (pp. 2537-2539). [8548314] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2018.8548314

Dynamics of Crack Propagation during Silicon Spalling. / Coll, Pablo Guimera; MEIER, Rico ; Bertoni, Mariana.

2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. p. 2537-2539 8548314.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Coll, PG, MEIER, R & Bertoni, M 2018, Dynamics of Crack Propagation during Silicon Spalling. in 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC., 8548314, Institute of Electrical and Electronics Engineers Inc., pp. 2537-2539, 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018, Waikoloa Village, United States, 6/10/18. https://doi.org/10.1109/PVSC.2018.8548314

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Dynamics of Crack Propagation during Silicon Spalling

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Keywords

ASJC Scopus subject areas

UN SDGs

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