Downstream oxygen etching characteristics of polymers from the parylene family

Russell R A Callahan, Kristin G. Pruden, Gregory Raupp, Stephen P. Beaudoin

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Abstract

The downstream oxygen etching characteristics of polymers from the parylene family were discussed. The apparent activation energy for the etch process of the three types of parylene: parylene-N, patylene-C and parylene AF-4, was also discussed. It was found out that a likely rate-limiting step in the etching was the ring opening process.

Original languageEnglish (US)
Pages (from-to)1496-1500
Number of pages5
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume21
Issue number4
StatePublished - Jul 1 2003

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ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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