Distributed object computing: DEVS-based modeling and simulation

Daryl Hild, Hessam S. Sarjoughian, Bernard P. Zeigler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This research examines an approach to modeling and simulating distributed object computing systems in terms of distributed software components mapped onto a set of interconnected network nodes. The overall model of a distributed object computing system has clearly separated hardware and software components enabling co-design engineering. The software component models form a distributed cooperative object (DCO) model to represent interacting software objects. The hardware component models form a loosely coupled network (LCN) model of processing nodes, network gates, and communication links interconnecting them. The software objects of the DCO are then 'distributed' across the processors of the LCN to form a distributed object computing system (DOC) model. This approach facilitates design analysis of each of these components separately as well as the combined systems behavior. The Discrete Event System Specification (DEVS) formalism is used to implement dynamic models of the DCO components, LCN components, and experimental frames to analyze system behavior.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages147-157
Number of pages11
ISBN (Print)0819431702
StatePublished - Jan 1 1999
Externally publishedYes
EventProceedings of the 1999 Enabling Technology for Simulation Science III - Orlando, FL, USA
Duration: Apr 6 1999Apr 8 1999

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume3696
ISSN (Print)0277-786X

Other

OtherProceedings of the 1999 Enabling Technology for Simulation Science III
CityOrlando, FL, USA
Period4/6/994/8/99

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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