In this letter we introduce a new approach to fabricating nano-scale metallic features by combining best merits of micro-forming, nanoimprint lithography, and electrochemical nanoimprinting. We study the mechanical properties of Ag2S, a solid-state superionic conductor previously reported by Hsu et al.  for electrochemical nanoimprinting (S4 process), and explore its capability for embossing using a Si mold fabricated using electron-beam lithography. By circumventing the traditional route of stamp preparation using Focused Ion Beam (FIB), we greatly enhance the capability of electrochemical nanoimprinting. Using an embossed stamp, we demonstrate features <10 nm; and patterns on areas >30 mm2. Application of an embossed Ag2S stamp is a significant step towards extending the S4 process for direct metal patterning of features beyond the capability of current processes.