Direct fabrication of a-Si:H TFT arrays on flexible substrates for high information content flexible displays: Challenges and solutions

Gregory Raupp, Shawn M. O'Rourke, Douglas E. Loy, Curt Moyer, Scott K. Ageno, Barry P. O'Brien, Dirk Bottesch, Edward J. Bawolek, Michael Marrs, Jeff Dailey, Jann Kaminski, David Allee, Sameer M. Venugopal, Rita Cordova

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The principal challenges to direct fabrication of high performance a-Si:H transistor arrays on plastic and on flexible stainless steel substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature TFT fabrication processes, and management of dimensional instability in the case of plastic substrates, and planarization and management of CTE mismatch in the case of stainless steel foils. The technology solutions developed at the Flexible Display Center to address these challenges are described.

Original languageEnglish (US)
Title of host publicationIDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings
Pages345-348
Number of pages4
StatePublished - Dec 1 2007
EventInternational Display Manufacturing Conference and Exhibition, IDMC 2007 - Taipei, Taiwan, Province of China
Duration: Jul 3 2007Jul 6 2007

Publication series

NameIDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings

Other

OtherInternational Display Manufacturing Conference and Exhibition, IDMC 2007
Country/TerritoryTaiwan, Province of China
CityTaipei
Period7/3/077/6/07

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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