Direct fabrication of a-Si: H thin film transistor arrays on flexible substrates: Critical challenges and enabling solutions

Shawn M. O'Rourke, Douglas E. Loy, Curt Moyer, Edward J. Bawolek, Scott K. Ageno, Barry P. O'Brien, Michael Marrs, Dirk Bottesch, Jeff Dailey, Rob Naujokaitis, Jann P. Kaminski, David Allee, Sameer M. Venugopal, Jesmin Haq, Nicholas Colaneri, Gregory Raupp

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.

Original languageEnglish (US)
Title of host publicationProceedings of International Meeting on Information Display
Pages1459-1462
Number of pages4
Volume8
StatePublished - 2008
Event8th International Meeting on Information Display - International Display Manufacturing Conference 2008 and Asia Display 2008, IMID/IDMC/ASIA DISPLAY 2008 - Ilsan, Korea, Republic of
Duration: Oct 13 2008Oct 17 2008

Other

Other8th International Meeting on Information Display - International Display Manufacturing Conference 2008 and Asia Display 2008, IMID/IDMC/ASIA DISPLAY 2008
Country/TerritoryKorea, Republic of
CityIlsan
Period10/13/0810/17/08

Keywords

  • Flexible electrophoretic display
  • Manufacturing processes
  • Metal foil
  • Plastic

ASJC Scopus subject areas

  • General Engineering

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