Abstract
In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.
Original language | English (US) |
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Title of host publication | Proceedings of International Meeting on Information Display |
Pages | 1459-1462 |
Number of pages | 4 |
Volume | 8 |
State | Published - 2008 |
Event | 8th International Meeting on Information Display - International Display Manufacturing Conference 2008 and Asia Display 2008, IMID/IDMC/ASIA DISPLAY 2008 - Ilsan, Korea, Republic of Duration: Oct 13 2008 → Oct 17 2008 |
Other
Other | 8th International Meeting on Information Display - International Display Manufacturing Conference 2008 and Asia Display 2008, IMID/IDMC/ASIA DISPLAY 2008 |
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Country/Territory | Korea, Republic of |
City | Ilsan |
Period | 10/13/08 → 10/17/08 |
Keywords
- Flexible electrophoretic display
- Manufacturing processes
- Metal foil
- Plastic
ASJC Scopus subject areas
- General Engineering