Abstract
In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.
Original language | English (US) |
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Title of host publication | SID Conference Record of the International Display Research Conference |
Pages | 122-125 |
Number of pages | 4 |
State | Published - 2008 |
Event | 28th International Display Research Conference, IDRC'08 - Orlando, FL, United States Duration: Nov 4 2008 → Nov 6 2008 |
Other
Other | 28th International Display Research Conference, IDRC'08 |
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Country | United States |
City | Orlando, FL |
Period | 11/4/08 → 11/6/08 |
Keywords
- Electrophoretic displays
- Manufacturing processes
- Metal foil
- Pilot line
- Plastic
- Reflective flexible displays
ASJC Scopus subject areas
- Electrical and Electronic Engineering