Development of protein chips based on self-assembled monolayer and protein A

Ling Sheng Jang, Hao Kai Keng, Yi Chu Hsu, Deirdre Meldrum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to improve the steric hindrances and less ordered structures in the long-chain SAMs, the SAM of 4,4-Dithiodibutyric acid (4,4- DTBA) was investigated to be a thin monolayer for the protein chip. This work presents the feasibility study of 4,4- DTBA as a monolayer of the protein chip based on gold surface. Characterizations of surface topography using atomic force microscopy (AFM), contact angle and fluorescence using protein A-FITC were performed to investigate the binding efficiency for the SAMs of 4,4- DTBA and 11- mercaptoundecanoic acid (11- MUA). The results show that the binding efficiency of 4,4- DTBA is higher than that of 11- MUA. The SAM of 4,4-DTBA can be used as a monolayer for the protein chip and may have a comparable binding efficiency.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE International Symposium on Circuits and Systems
Pages4353-4358
Number of pages6
StatePublished - 2006
Externally publishedYes
EventISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems - Kos, Greece
Duration: May 21 2006May 24 2006

Other

OtherISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems
CountryGreece
CityKos
Period5/21/065/24/06

Fingerprint

Staphylococcal Protein A
Self assembled monolayers
Monolayers
Proteins
Acids
Fluorescein-5-isothiocyanate
Surface topography
Gold
Contact angle
Atomic force microscopy
Fluorescence
11-mercaptoundecanoic acid

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Jang, L. S., Keng, H. K., Hsu, Y. C., & Meldrum, D. (2006). Development of protein chips based on self-assembled monolayer and protein A. In Proceedings - IEEE International Symposium on Circuits and Systems (pp. 4353-4358). [1693593]

Development of protein chips based on self-assembled monolayer and protein A. / Jang, Ling Sheng; Keng, Hao Kai; Hsu, Yi Chu; Meldrum, Deirdre.

Proceedings - IEEE International Symposium on Circuits and Systems. 2006. p. 4353-4358 1693593.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jang, LS, Keng, HK, Hsu, YC & Meldrum, D 2006, Development of protein chips based on self-assembled monolayer and protein A. in Proceedings - IEEE International Symposium on Circuits and Systems., 1693593, pp. 4353-4358, ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Kos, Greece, 5/21/06.
Jang LS, Keng HK, Hsu YC, Meldrum D. Development of protein chips based on self-assembled monolayer and protein A. In Proceedings - IEEE International Symposium on Circuits and Systems. 2006. p. 4353-4358. 1693593
Jang, Ling Sheng ; Keng, Hao Kai ; Hsu, Yi Chu ; Meldrum, Deirdre. / Development of protein chips based on self-assembled monolayer and protein A. Proceedings - IEEE International Symposium on Circuits and Systems. 2006. pp. 4353-4358
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