Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Ganapati Bhat; Hang Gao; Sumit K. Mandal; Umit Y. Ogras; Sule Ozev

doi:10.1109/MDAT.2020.2968263

Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Ganapati Bhat, Hang Gao, Sumit K. Mandal, Umit Y. Ogras, Sule Ozev

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application. - Vivek Chickermane, Cadence Design Systems

Original language	English (US)
Article number	8963916
Pages (from-to)	35-41
Number of pages	7
Journal	IEEE Design and Test
Volume	37
Issue number	4
DOIs	https://doi.org/10.1109/MDAT.2020.2968263
State	Published - Aug 2020

Keywords

COMSOL Multiphysics
Flexible hybrid electronics
integer linear programming
stress
test

ASJC Scopus subject areas

Software
Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/MDAT.2020.2968263

Cite this

@article{a9c8b3c510b0483795ea0a92d530dbc3,

title = "Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead",

abstract = "Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application. - Vivek Chickermane, Cadence Design Systems ",

keywords = "COMSOL Multiphysics, Flexible hybrid electronics, integer linear programming, stress, test",

author = "Ganapati Bhat and Hang Gao and Mandal, {Sumit K.} and Ogras, {Umit Y.} and Sule Ozev",

note = "Funding Information: This work was supported in part by NSF under Grant SHF-1617562, in part by NSF CAREER Award CNS-1651624, in part by Semiconductor Research Corporation under task ID 2712.003, and in part by The Defense Advanced Research Projects Agency (DARPA) Young Faculty Award (YFA) under Grant D14AP00068. Publisher Copyright: {\textcopyright} 2013 IEEE.",

year = "2020",

month = aug,

doi = "10.1109/MDAT.2020.2968263",

language = "English (US)",

volume = "37",

pages = "35--41",

journal = "IEEE Design and Test",

issn = "2168-2356",

publisher = "IEEE Computer Society",

number = "4",

}

TY - JOUR

T1 - Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

AU - Bhat, Ganapati

AU - Gao, Hang

AU - Mandal, Sumit K.

AU - Ogras, Umit Y.

AU - Ozev, Sule

N1 - Funding Information: This work was supported in part by NSF under Grant SHF-1617562, in part by NSF CAREER Award CNS-1651624, in part by Semiconductor Research Corporation under task ID 2712.003, and in part by The Defense Advanced Research Projects Agency (DARPA) Young Faculty Award (YFA) under Grant D14AP00068. Publisher Copyright: © 2013 IEEE.

PY - 2020/8

Y1 - 2020/8

N2 - Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application. - Vivek Chickermane, Cadence Design Systems

AB - Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application. - Vivek Chickermane, Cadence Design Systems

KW - COMSOL Multiphysics

KW - Flexible hybrid electronics

KW - integer linear programming

KW - stress

KW - test

UR - http://www.scopus.com/inward/record.url?scp=85078124521&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85078124521&partnerID=8YFLogxK

U2 - 10.1109/MDAT.2020.2968263

DO - 10.1109/MDAT.2020.2968263

M3 - Article

AN - SCOPUS:85078124521

VL - 37

SP - 35

EP - 41

JO - IEEE Design and Test

JF - IEEE Design and Test

SN - 2168-2356

IS - 4

M1 - 8963916

ER -

Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Abstract

Keywords

ASJC Scopus subject areas

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