Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Ganapati Bhat; Hang Gao; Sumit K. Mandal; Umit Y. Ogras; Sule Ozev

doi:10.1109/MDAT.2020.2968263

Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Ganapati Bhat, Hang Gao, Sumit K. Mandal, Umit Y. Ogras, Sule Ozev

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application.

Original language	English (US)
Article number	8963916
Pages (from-to)	35-41
Number of pages	7
Journal	IEEE Design and Test
Volume	37
Issue number	4
DOIs	https://doi.org/10.1109/MDAT.2020.2968263
State	Published - Aug 2020

Keywords

COMSOL Multiphysics
Flexible hybrid electronics
integer linear programming
stress
test

ASJC Scopus subject areas

Software
Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/MDAT.2020.2968263

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title = "Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead",

abstract = "Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application.",

keywords = "COMSOL Multiphysics, Flexible hybrid electronics, integer linear programming, stress, test",

author = "Ganapati Bhat and Hang Gao and Mandal, {Sumit K.} and Ogras, {Umit Y.} and Sule Ozev",

note = "Funding Information: This work was supported in part by NSF under Grant SHF-1617562, in part by NSF CAREER Award CNS-1651624, in part by Semiconductor Research Corporation under task ID 2712.003, and in part by The Defense Advanced Research Projects Agency (DARPA) Young Faculty Award (YFA) under Grant D14AP00068. Publisher Copyright: {\textcopyright} 2013 IEEE.",

year = "2020",

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language = "English (US)",

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AU - Gao, Hang

AU - Mandal, Sumit K.

AU - Ogras, Umit Y.

AU - Ozev, Sule

N1 - Funding Information: This work was supported in part by NSF under Grant SHF-1617562, in part by NSF CAREER Award CNS-1651624, in part by Semiconductor Research Corporation under task ID 2712.003, and in part by The Defense Advanced Research Projects Agency (DARPA) Young Faculty Award (YFA) under Grant D14AP00068. Publisher Copyright: © 2013 IEEE.

PY - 2020/8

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N2 - Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application.

AB - Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application.

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KW - integer linear programming

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KW - test

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Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

Abstract

Keywords

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