Determining an appropriate number of foups in semiconductor wafer fabrication facilities

Jens Zimmermann, Lars Mönch, Scott J. Mason, John Fowler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, multiple orders per job type formation and release strategies are described for semiconductor wafer fabrication facilities (wafer fabs). Different orders are grouped into one job because orders of an individual customer very often fill only a portion of a Front-Opening Unified Pod (FOUP). A FOUP is assigned to each job and is used to move the job throughout the wafer fab after the job formation. We determine an appropriate number of FOUPs for a given order release rate that will yield acceptable values for on-time delivery performance, cycle time, and throughput via discrete event simulation.

Original languageEnglish (US)
Title of host publicationProceedings - Winter Simulation Conference
Pages2164-2170
Number of pages7
DOIs
StatePublished - 2008
Event2008 Winter Simulation Conference, WSC 2008 - Miami, FL, United States
Duration: Dec 7 2008Dec 10 2008

Other

Other2008 Winter Simulation Conference, WSC 2008
CountryUnited States
CityMiami, FL
Period12/7/0812/10/08

Fingerprint

Discrete event simulation
Wafer
Semiconductors
Fabrication
Throughput
Semiconductor materials
Discrete Event Simulation
Customers

ASJC Scopus subject areas

  • Software
  • Modeling and Simulation
  • Computer Science Applications

Cite this

Zimmermann, J., Mönch, L., Mason, S. J., & Fowler, J. (2008). Determining an appropriate number of foups in semiconductor wafer fabrication facilities. In Proceedings - Winter Simulation Conference (pp. 2164-2170). [4736315] https://doi.org/10.1109/WSC.2008.4736315

Determining an appropriate number of foups in semiconductor wafer fabrication facilities. / Zimmermann, Jens; Mönch, Lars; Mason, Scott J.; Fowler, John.

Proceedings - Winter Simulation Conference. 2008. p. 2164-2170 4736315.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zimmermann, J, Mönch, L, Mason, SJ & Fowler, J 2008, Determining an appropriate number of foups in semiconductor wafer fabrication facilities. in Proceedings - Winter Simulation Conference., 4736315, pp. 2164-2170, 2008 Winter Simulation Conference, WSC 2008, Miami, FL, United States, 12/7/08. https://doi.org/10.1109/WSC.2008.4736315
Zimmermann J, Mönch L, Mason SJ, Fowler J. Determining an appropriate number of foups in semiconductor wafer fabrication facilities. In Proceedings - Winter Simulation Conference. 2008. p. 2164-2170. 4736315 https://doi.org/10.1109/WSC.2008.4736315
Zimmermann, Jens ; Mönch, Lars ; Mason, Scott J. ; Fowler, John. / Determining an appropriate number of foups in semiconductor wafer fabrication facilities. Proceedings - Winter Simulation Conference. 2008. pp. 2164-2170
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