Abstract
An analytical model for switching noise with an on-chip bypass capacitor is presented. To incorporate various design parameters into the model, a differential equation is formulated and solved by Laplace transforms. Based on the model, optimum on-chip capacitor size is determined and compared with HSPICE simulation results. In the simulation, a realistic 0.6 μm BSIM device model at best process conditions is used and good correlation is demonstrated.
Original language | English (US) |
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Title of host publication | Proceedings - IEEE International Symposium on Circuits and Systems |
Editors | Anon |
Publisher | IEEE |
Pages | 1724-1727 |
Number of pages | 4 |
Volume | 3 |
State | Published - 1997 |
Event | Proceedings of the 1997 IEEE International Symposium on Circuits and Systems, ISCAS'97. Part 4 (of 4) - Hong Kong, Hong Kong Duration: Jun 9 1997 → Jun 12 1997 |
Other
Other | Proceedings of the 1997 IEEE International Symposium on Circuits and Systems, ISCAS'97. Part 4 (of 4) |
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City | Hong Kong, Hong Kong |
Period | 6/9/97 → 6/12/97 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials