Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model

Guoyi Li, Javaid Ikram, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents the development of a delamination detection framework for integrated circuit packages aiming at quantitative detection of sealant delamination between integrated heat sink and substrate, which is one of the potential failure mechanisms in integrated circuit packages. This method is expected to overcome the destructive nature of most existing techniques and maintain a relatively low cost of development. Ultrasonic guided waves are used as the interrogation method due to their sensitivity to small-size damage and capability of through-thickness penetration. The complexity of the received ultrasonic signals, caused by the geometric heterogeneity, is resolved and interpreted using a time-frequency signal processing technique. The extracted ultrasonic information, including time-of-arrival and amplitude of wave modes received from different sensing paths under multiple excitation frequencies, is used to construct the feature space for training. An unsupervised learning method, multivariate Gaussian model, is implemented as an information fusion and delamination detection tool. The multivariate Gaussian model efficiently investigates the distribution of feature space including correlations between features and flag the outliers without labeled examples. Results from the developed model are compared with two existing evaluation methods, including pullout test and a metric indicating the extent of delamination, which indicates that the developed method possesses a similar level of accuracy.

Original languageEnglish (US)
Title of host publicationSmart Structures and NDE for Energy Systems and Industry 4.0
EditorsChristopher Niezrecki, Kerrie Gath, Norbert G. Meyendorf
PublisherSPIE
ISBN (Electronic)9781510626010
DOIs
StatePublished - Jan 1 2019
EventSmart Structures and NDE for Energy Systems and Industry 4.0 2019 - Denver, United States
Duration: Mar 4 2019Mar 5 2019

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10973
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceSmart Structures and NDE for Energy Systems and Industry 4.0 2019
CountryUnited States
CityDenver
Period3/4/193/5/19

Fingerprint

sealers
Sealants
Delamination
Multivariate Models
Gaussian Model
Integrated Circuits
integrated circuits
Integrated circuits
ultrasonics
Feature Space
Ultrasonics
Ultrasonic Wave
Guided Waves
Unsupervised learning
Time of Arrival
Failure Mechanism
Information fusion
Information Fusion
Guided electromagnetic wave propagation
Unsupervised Learning

Keywords

  • Delamination Detection
  • Integrated Circuit Package
  • Multivariate Gaussian
  • Ultrasonic Guided Wave
  • Unsupervised Learning

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Li, G., Ikram, J., Chattopadhyay, A., Neerukatti, R. K., & Liu, K. C. (2019). Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model. In C. Niezrecki, K. Gath, & N. G. Meyendorf (Eds.), Smart Structures and NDE for Energy Systems and Industry 4.0 [109730H] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10973). SPIE. https://doi.org/10.1117/12.2513790

Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model. / Li, Guoyi; Ikram, Javaid; Chattopadhyay, Aditi; Neerukatti, Rajesh Kumar; Liu, Kuang C.

Smart Structures and NDE for Energy Systems and Industry 4.0. ed. / Christopher Niezrecki; Kerrie Gath; Norbert G. Meyendorf. SPIE, 2019. 109730H (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10973).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Li, G, Ikram, J, Chattopadhyay, A, Neerukatti, RK & Liu, KC 2019, Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model. in C Niezrecki, K Gath & NG Meyendorf (eds), Smart Structures and NDE for Energy Systems and Industry 4.0., 109730H, Proceedings of SPIE - The International Society for Optical Engineering, vol. 10973, SPIE, Smart Structures and NDE for Energy Systems and Industry 4.0 2019, Denver, United States, 3/4/19. https://doi.org/10.1117/12.2513790
Li G, Ikram J, Chattopadhyay A, Neerukatti RK, Liu KC. Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model. In Niezrecki C, Gath K, Meyendorf NG, editors, Smart Structures and NDE for Energy Systems and Industry 4.0. SPIE. 2019. 109730H. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.2513790
Li, Guoyi ; Ikram, Javaid ; Chattopadhyay, Aditi ; Neerukatti, Rajesh Kumar ; Liu, Kuang C. / Detection of sealant delamination in integrated circuit package using a multivariate Gaussian model. Smart Structures and NDE for Energy Systems and Industry 4.0. editor / Christopher Niezrecki ; Kerrie Gath ; Norbert G. Meyendorf. SPIE, 2019. (Proceedings of SPIE - The International Society for Optical Engineering).
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