Desorption and sublimation kinetics for fluorinated aluminum nitride surfaces

Engineering & Materials Science

• Aluminum nitride 100%
• Sublimation 99%
• Desorption 80%
• Temperature programmed desorption 47%
• Hydrogen 43%
• Photoelectron spectroscopy 26%
• Activation energy 16%
• Thin films 14%
• X rays 14%
• Mass spectrometers 11%
• Dehydrogenation 10%
• Nanoelectronics 10%
• Fluorine 10%
• Temperature 9%
• Ammonia 8%
• Methanol 7%
• Adsorption 7%
• Nitrogen 7%
• Plasmas 7%
• Fabrication 5%
• Water 4%

Physics & Astronomy

• aluminum nitrides 79%
• sublimation 77%
• desorption 61%
• kinetics 41%
• hydrofluoric acid 33%
• x ray spectroscopy 10%
• surface temperature 10%
• photoelectron spectroscopy 8%
• ionizers 7%
• activation energy 7%
• dehydrogenation 6%
• halogens 6%
• mass spectrometers 5%
• thin films 5%
• methyl alcohol 5%
• ammonia 5%
• fluorine 5%
• aqueous solutions 4%
• fragmentation 4%
• temperature 4%
• adsorption 4%
• nitrogen 3%
• hydrogen 3%
• fabrication 3%
• water 3%

Chemical Compounds

• Aluminium Nitride 94%
• Sublimation 80%
• Desorption 53%
• Hydrogen Fluoride 36%
• Surface 22%
• Photoelectron Spectroscopy 11%
• Reaction Activation Energy 8%
• Surface Temperature 7%
• Dehydrogenation 5%
• Halogen 5%
• Fluorine Atom 5%
• Fragmentation 4%
• Ammonia 4%
• Sorption 4%
• Plasma 3%
• Methanol 3%
• Nitrogen 3%
• Aqueous Solution 3%
• Hydrogen 2%