Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms

Ying Ju Yu, Carole-Jean Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Modern high-performance processors are embedded in portable electronics, such as smartphones, self-driving automobiles, and augmented reality wearable. These computing platforms provide real-time direction navigation, high definition video entertainment, real-time sensing and control. One of the major performance limiting factors in these platforms is the poorly designed thermal solution to prevent overheating at the processor transistor junction and at the platform surface. The former limits the maximum operating temperature of transistors to guarantee reliability and lifetime whereas the latter limits the maximum platform surface temperature to ensure user ergonomic comfort. To design effective cooling solutions for high-performance, multi-layer, multi-processor platforms, an accurate and detailed platform level temperature model is needed. In this work, we present a detailed finite volume model to predict the temperature behavior of a tightly packaged, high-performance portable platform, from the system level down to the processor architecture level. We first characterize the thermal response of real-world, representative mobile workloads and perform parametric studies to predict the processor junction and platform surface temperature based on the properties of the platform. We observe that thermal hot spots are sensitive to workload computation characteristics. In particular, for mobile workloads, such as web browsing, computations often occur in short time burst, leading to instantaneous power spikes. This results in temperature spikes as thermal hot spots. To mitigate the thermal issue, modern systems implement dynamic voltage and frequency scaling during high performance and high power scenario to prevent cores from overheating. We validate the proposed temperature model used to predict the maximum temperature at the processor chip and at the platform surface, with measurements from the embedded temperature sensors and an infrared camera. The temperature prediction accuracy for hot spots on the processor chip and on the platform surface is demonstrated to be higher than 90%. With the tool, we show that the physical construction (such as air gaps and material properties) and the floor plan of the multi-layer platform have a profound effect on the system temperature behavior. As the air gap between the different layers of the computing platform increases, the processor temperature rises significantly. Also there exists an optimal thickness setting of the air gap for platform surface thermal spreading. We hope the detailed characterization results, the developed temperature prediction tool, and the insights presented in the paper can motivate advanced thermal management solution for high-performance embedded platforms in the years to come.

Original languageEnglish (US)
Title of host publicationProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages992-999
Number of pages8
ISBN (Electronic)9781538612729
DOIs
StatePublished - Jul 24 2018
Event17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States
Duration: May 29 2018Jun 1 2018

Other

Other17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
CountryUnited States
CitySan Diego
Period5/29/186/1/18

Fingerprint

Temperature
Hot Temperature
Transistors
Air
Augmented reality
Smartphones
Temperature sensors
Ergonomics
Temperature control
Automobiles
Materials properties
Navigation
Electronic equipment
Cameras
Cooling
Infrared radiation

Keywords

  • portable electronics
  • skin temperature
  • smartphones
  • temperature prediction
  • temperature-aware floor plan
  • thermal management
  • Thermal modeling

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality

Cite this

Yu, Y. J., & Wu, C-J. (2018). Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms. In Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 (pp. 992-999). [8419601] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2018.8419601

Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms. / Yu, Ying Ju; Wu, Carole-Jean.

Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 992-999 8419601.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yu, YJ & Wu, C-J 2018, Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms. in Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018., 8419601, Institute of Electrical and Electronics Engineers Inc., pp. 992-999, 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, San Diego, United States, 5/29/18. https://doi.org/10.1109/ITHERM.2018.8419601
Yu YJ, Wu C-J. Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms. In Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 992-999. 8419601 https://doi.org/10.1109/ITHERM.2018.8419601
Yu, Ying Ju ; Wu, Carole-Jean. / Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms. Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 992-999
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