Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit

Lawrence T. Clark; Vinay Vashishtha; David M. Harris; Samuel Dietrich; Zunyan Wang

doi:10.1109/MSE.2017.7945071

Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit

Lawrence T. Clark, Vinay Vashishtha, David M. Harris, Samuel Dietrich, Zunyan Wang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

28 Scopus citations

Abstract

Educators and researchers exploring integrated circuit design methods need models and design flows for advanced integrated circuit processes. As commercial processes have become highly proprietary, predictive technology models fill the gap. This work describes a design flow for ASAP7, the first 7 nm FinFET PDK, including schematic and layout entry, library characterization, synthesis, placement and routing, parasitic extraction, and HSPICE simulation.

Original language	English (US)
Title of host publication	2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-4
Number of pages	4
ISBN (Electronic)	9781509064311
DOIs	https://doi.org/10.1109/MSE.2017.7945071
State	Published - Jun 8 2017
Event	2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017 - Banff, Canada Duration: May 11 2017 → May 12 2017

Other

Other	2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017
Country/Territory	Canada
City	Banff
Period	5/11/17 → 5/12/17

Keywords

design flow
FinFETs
predictive technology model

ASJC Scopus subject areas

Education
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/MSE.2017.7945071

Cite this

Clark, L. T., Vashishtha, V., Harris, D. M., Dietrich, S., & Wang, Z. (2017). Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit. In 2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017 (pp. 1-4). Article 7945071 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MSE.2017.7945071

Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit. / Clark, Lawrence T.; Vashishtha, Vinay; Harris, David M. et al.
2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-4 7945071.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Clark, LT, Vashishtha, V, Harris, DM, Dietrich, S & Wang, Z 2017, Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit. in 2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017., 7945071, Institute of Electrical and Electronics Engineers Inc., pp. 1-4, 2017 IEEE International Conference on Microelectronic Systems Education, MSE 2017, Banff, Canada, 5/11/17. https://doi.org/10.1109/MSE.2017.7945071

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Design flows and collateral for the ASAP7 7nm FinFET predictive process design kit

Abstract

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Keywords

ASJC Scopus subject areas

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