Abstract
Methods for design, double-sided post-processing and packaging of commercially fabricated CMOS chips for Bio-MEMS applications are presented. These techniques apply to a wide range of devices and allow for both electrical and optical stimulation and assessment of biological specimens. The techniques are straightforward and can be applied to dies fabricated through state of the art CMOS foundries. The resulting assemblies are designed to withstand environments commonly necessary for working with the biological materials such as biological temperatures, pressures, and moisture or autoclave. The proposed packaging is extremely versatile and can be modified to accommodate numerous additions to the system such as syringe inlets or mountable elements.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings - IEEE International Symposium on Circuits and Systems |
| Volume | 1 |
| State | Published - 2002 |
| Externally published | Yes |
| Event | 2002 IEEE International Symposium on Circuits and Systems - Phoenix, AZ, United States Duration: May 26 2002 → May 29 2002 |
Other
| Other | 2002 IEEE International Symposium on Circuits and Systems |
|---|---|
| Country/Territory | United States |
| City | Phoenix, AZ |
| Period | 5/26/02 → 5/29/02 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials