Abstract

One of the most life-threatening neural conditions is elevated intracranial pressure (ICP); it is associated with ischemia and poor short- and long-term outcomes. Currently, monitoring systems that accurately measure ICP are either highly invasive or inaccurate. This work explores the design and evaluation of an epidural intracranial pressure monitoring system for low-cost, minimally invasive detection. Our goal is to develop a monitoring system that could also be integrated with an electrocorticography (ECoG) system. To this end we created a minimally invasive epidural ICP monitor for use with a 2 mm burr hole craniotomy. A MEMS piezoresistive sensors is used in the system, and its performance is evaluated for intracranial pressure measurements. Our system is calibrated and tested on the benchtop and demonstrated in vivo using an animal model.

Original languageEnglish (US)
Title of host publication2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages4483-4486
Number of pages4
Volume2016-October
ISBN (Electronic)9781457702204
DOIs
StatePublished - Oct 13 2016
Event38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016 - Orlando, United States
Duration: Aug 16 2016Aug 20 2016

Other

Other38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016
CountryUnited States
CityOrlando
Period8/16/168/20/16

Keywords

  • Animal studies
  • Epidural
  • Intracranial pressure monitoring
  • Low-cost
  • MEMS

ASJC Scopus subject areas

  • Signal Processing
  • Biomedical Engineering
  • Computer Vision and Pattern Recognition
  • Health Informatics

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  • Cite this

    Kumaran, R. S., Greger, B., & Blain Christen, J. (2016). Design and evaluation of a low cost intracranial pressure monitoring system. In 2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016 (Vol. 2016-October, pp. 4483-4486). [7591723] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMBC.2016.7591723