Design and construction issues for 300mm semiconductor manufacturing facilities

Saloni Merchant, Allan Chasey

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    From the early days of four - function calculators and transistor radios, the microelectronics industry has expanded considerably. Semiconductor chips have become an essential ingredient in consumer appliances such as computers, multimedia systems, cell phones, pagers, and automobiles. To keep pace with the growing demand for semiconductor chips, manufacturers have used strategies such as reducing device size and increasing wafer diameter to increase manufacturing capacity. In line with this trend, the semiconductor industry is currently poised to transition to a wafer size of 300mm (12″) from the current 200mm (8″). This change is expected to be the most challenging and expensive transition in the history of the semiconductor industry. While a considerable amount of research is being done to analyze the influence of this transition on 300mm processes and tools, little attention has been paid to studying its effect on the design and construction of 300mm wafer manufacturing facilities. This paper analyzes the transition to 300mm wafer fabs from a construction standpoint. It identifies changes in the material handling system, process tools, utility consumption, process cleanliness requirements, and reduced project delivery time as the key technology areas that influence construction in terms of space, layout, structure, materials, and schedule.

    Original languageEnglish (US)
    Title of host publicationProceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World
    Pages714-726
    Number of pages13
    Volume278
    DOIs
    StatePublished - 2000
    EventConstruction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World - Orlando, FL, United States
    Duration: Feb 20 2000Feb 22 2000

    Other

    OtherConstruction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World
    CountryUnited States
    CityOrlando, FL
    Period2/20/002/22/00

    Fingerprint

    Semiconductor materials
    Industry
    Multimedia systems
    Radio receivers
    Materials handling
    Microelectronics
    Automobiles
    Transistors

    ASJC Scopus subject areas

    • Civil and Structural Engineering
    • Building and Construction

    Cite this

    Merchant, S., & Chasey, A. (2000). Design and construction issues for 300mm semiconductor manufacturing facilities. In Proceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World (Vol. 278, pp. 714-726) https://doi.org/10.1061/40475(278)76

    Design and construction issues for 300mm semiconductor manufacturing facilities. / Merchant, Saloni; Chasey, Allan.

    Proceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World. Vol. 278 2000. p. 714-726.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Merchant, S & Chasey, A 2000, Design and construction issues for 300mm semiconductor manufacturing facilities. in Proceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World. vol. 278, pp. 714-726, Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World, Orlando, FL, United States, 2/20/00. https://doi.org/10.1061/40475(278)76
    Merchant S, Chasey A. Design and construction issues for 300mm semiconductor manufacturing facilities. In Proceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World. Vol. 278. 2000. p. 714-726 https://doi.org/10.1061/40475(278)76
    Merchant, Saloni ; Chasey, Allan. / Design and construction issues for 300mm semiconductor manufacturing facilities. Proceedings of Construction Congress VI: Building Together for a Better Tomorrow in an Increasingly Complex World. Vol. 278 2000. pp. 714-726
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