Abstract
A variety of techniques such as light field, structured illumination, and time-of-flight (TOF) are commonly used for depth acquisition in consumer imaging, robotics and many other applications. Unfortunately, each technique suffers from its individual limitations preventing robust depth sensing. In this paper, we explore the strengths and weaknesses of combining light field and time-of-flight imaging, particularly the feasibility of an on-chip implementation as a single hybrid depth sensor. We refer to this combination as depth field imaging. Depth fields combine light field advantages such as synthetic aperture refocusing with TOF imaging advantages such as high depth resolution and coded signal processing to resolve multipath interference. We show applications including synthesizing virtual apertures for TOF imaging, improved depth mapping through partial and scattering occluders, and single frequency TOF phase unwrapping. Utilizing space, angle, and temporal coding, depth fields can improve depth sensing in the wild and generate new insights into the dimensions of light's plenoptic function.
Original language | English (US) |
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Title of host publication | Proceedings - 2015 International Conference on 3D Vision, 3DV 2015 |
Editors | Michael Brown, Jana Kosecka, Christian Theobalt |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 1-9 |
Number of pages | 9 |
ISBN (Electronic) | 9781467383325 |
DOIs | |
State | Published - Nov 20 2015 |
Externally published | Yes |
Event | 2015 International Conference on 3D Vision, 3DV 2015 - Lyon, France Duration: Oct 19 2015 → Oct 22 2015 |
Other
Other | 2015 International Conference on 3D Vision, 3DV 2015 |
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Country/Territory | France |
City | Lyon |
Period | 10/19/15 → 10/22/15 |
Keywords
- Apertures
- Cameras
- Image resolution
- Lenses
- Optical imaging
- Sensors
ASJC Scopus subject areas
- Computer Vision and Pattern Recognition