Demonstration of Non-Lamination Encapsulation Techniques for Thin Film Solar Modules

Sam Ellis, Larry Maple, Tushar Shimpi, Govindasamy Tamizhmani, Walajabad Sampath, Ashwini Pavgi, Kurt L. Barth

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new encapsulation architecture for thin film photovoltaics is under development. The motivation for this project is to lower manufacturing costs and improve module reliability. During this project prototype manufacturing processes and equipment have been developed and demonstrated. During the past year, the processing hardware has been commissioned, tested and samples of the new module architecture fabricated. The technology and architecture show great opportunity with each process being demonstrated under 30 seconds and sample modules passing initial accelerated testing.

Original languageEnglish (US)
Title of host publication2020 47th IEEE Photovoltaic Specialists Conference, PVSC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1924-1926
Number of pages3
ISBN (Electronic)9781728161150
DOIs
StatePublished - Jun 14 2020
Event47th IEEE Photovoltaic Specialists Conference, PVSC 2020 - Calgary, Canada
Duration: Jun 15 2020Aug 21 2020

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
Volume2020-June
ISSN (Print)0160-8371

Conference

Conference47th IEEE Photovoltaic Specialists Conference, PVSC 2020
Country/TerritoryCanada
CityCalgary
Period6/15/208/21/20

Keywords

  • edge seal
  • encapsulation
  • manufacturing
  • reliability

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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