@inproceedings{ce4f03ba75984415b958d2607c7e2d22,
title = "Demonstration of Non-Lamination Encapsulation Techniques for Thin Film Solar Modules",
abstract = "A new encapsulation architecture for thin film photovoltaics is under development. The motivation for this project is to lower manufacturing costs and improve module reliability. During this project prototype manufacturing processes and equipment have been developed and demonstrated. During the past year, the processing hardware has been commissioned, tested and samples of the new module architecture fabricated. The technology and architecture show great opportunity with each process being demonstrated under 30 seconds and sample modules passing initial accelerated testing.",
keywords = "edge seal, encapsulation, manufacturing, reliability",
author = "Sam Ellis and Larry Maple and Tushar Shimpi and Govindasamy Tamizhmani and Walajabad Sampath and Ashwini Pavgi and Barth, {Kurt L.}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.; 47th IEEE Photovoltaic Specialists Conference, PVSC 2020 ; Conference date: 15-06-2020 Through 21-08-2020",
year = "2020",
month = jun,
day = "14",
doi = "10.1109/PVSC45281.2020.9300665",
language = "English (US)",
series = "Conference Record of the IEEE Photovoltaic Specialists Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1924--1926",
booktitle = "2020 47th IEEE Photovoltaic Specialists Conference, PVSC 2020",
}