Delay Compression: Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound

Brendan L. West, Jian Zhou, Chaitali Chakrabarti, Thomas F. Wenisch

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In 3D plane-wave ultrasound, computational requirements are directly proportional to the number of focal points in a volume. For a receive aperture of size of MxMy transducers, a beamforming aperture size of NxNy, and a depth of Mz focal points, Mx My Mz Nx Ny round-trip delays must be computed. To reduce this requirement, we decompose the planar transmit distance into two parts: (1) from the plane-wave's origin to the first point in each focal line, and (2) from the plane when it is touching the first point in each focal line to each subsequent focal point along that line. The latter distance, as well as the reflection distances, are symmetric across beamforming apertures, and thus their computation can be shared. This decomposition results in up to a Mx My reduction in the number of unique delays while retaining full image quality. Using our technique, precomputing delays and storing them in look-up tables (LUTs) is now possible for 3D plane-wave ultrasound for the first time, opening new doors for computational architectures in this field. Our method works with 2D, 3D, and 3D-separable variants of plane-wave ultrasound.

Original languageEnglish (US)
Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
PublisherIEEE Computer Society
Pages1278-1281
Number of pages4
ISBN (Electronic)9781728145969
DOIs
StatePublished - Oct 2019
Event2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
Duration: Oct 6 2019Oct 9 2019

Publication series

NameIEEE International Ultrasonics Symposium, IUS
Volume2019-October
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
CountryUnited Kingdom
CityGlasgow
Period10/6/1910/9/19

Fingerprint

plane waves
requirements
apertures
beamforming
retaining
transducers
decomposition

Keywords

  • accelerator
  • beamforming
  • plane-wave
  • ultrasound

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

Cite this

West, B. L., Zhou, J., Chakrabarti, C., & Wenisch, T. F. (2019). Delay Compression: Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound. In 2019 IEEE International Ultrasonics Symposium, IUS 2019 (pp. 1278-1281). [8925725] (IEEE International Ultrasonics Symposium, IUS; Vol. 2019-October). IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2019.8925725

Delay Compression : Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound. / West, Brendan L.; Zhou, Jian; Chakrabarti, Chaitali; Wenisch, Thomas F.

2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Computer Society, 2019. p. 1278-1281 8925725 (IEEE International Ultrasonics Symposium, IUS; Vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

West, BL, Zhou, J, Chakrabarti, C & Wenisch, TF 2019, Delay Compression: Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound. in 2019 IEEE International Ultrasonics Symposium, IUS 2019., 8925725, IEEE International Ultrasonics Symposium, IUS, vol. 2019-October, IEEE Computer Society, pp. 1278-1281, 2019 IEEE International Ultrasonics Symposium, IUS 2019, Glasgow, United Kingdom, 10/6/19. https://doi.org/10.1109/ULTSYM.2019.8925725
West BL, Zhou J, Chakrabarti C, Wenisch TF. Delay Compression: Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound. In 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Computer Society. 2019. p. 1278-1281. 8925725. (IEEE International Ultrasonics Symposium, IUS). https://doi.org/10.1109/ULTSYM.2019.8925725
West, Brendan L. ; Zhou, Jian ; Chakrabarti, Chaitali ; Wenisch, Thomas F. / Delay Compression : Reducing Delay Calculation Requirements for 3D Plane-Wave Ultrasound. 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Computer Society, 2019. pp. 1278-1281 (IEEE International Ultrasonics Symposium, IUS).
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