Abstract
A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. Deterioration of the electrical interconnections and components has been observed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1216-1219 |
| Number of pages | 4 |
| Journal | IEEE Transactions on Electrical Insulation |
| Volume | 26 |
| Issue number | 6 |
| DOIs | |
| State | Published - Dec 1991 |
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
Fingerprint Dive into the research topics of 'Degrading Effect of High-altitude Corona on Electronic Circuit Boards'. Together they form a unique fingerprint.
Cite this
Karady, G. G., Sirkis, M. D., & Oliva, J. R. (1991). Degrading Effect of High-altitude Corona on Electronic Circuit Boards. IEEE Transactions on Electrical Insulation, 26(6), 1216-1219. https://doi.org/10.1109/14.108161