Degrading Effect of High-altitude Corona on Electronic Circuit Boards

George G. Karady; Murray D. Sirkis; Jose R. Oliva

doi:10.1109/14.108161

Degrading Effect of High-altitude Corona on Electronic Circuit Boards

George G. Karady, Murray D. Sirkis, Jose R. Oliva

Electrical, Computer, and Energy Engineering, School of (ECEE)

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. Deterioration of the electrical interconnections and components has been observed.

Original language	English (US)
Pages (from-to)	1216-1219
Number of pages	4
Journal	IEEE Transactions on Electrical Insulation
Volume	26
Issue number	6
DOIs	https://doi.org/10.1109/14.108161
State	Published - Dec 1991

ASJC Scopus subject areas

Engineering(all)
Electrical and Electronic Engineering

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@article{32268b127d7b4fcd90425ea4b2ba096b,

title = "Degrading Effect of High-altitude Corona on Electronic Circuit Boards",

abstract = "A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. Deterioration of the electrical interconnections and components has been observed.",

author = "Karady, {George G.} and Sirkis, {Murray D.} and Oliva, {Jose R.}",

year = "1991",

month = dec,

doi = "10.1109/14.108161",

language = "English (US)",

volume = "26",

pages = "1216--1219",

journal = "IEEE Transactions on Dielectrics and Electrical Insulation",

issn = "1070-9878",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "6",

}

TY - JOUR

T1 - Degrading Effect of High-altitude Corona on Electronic Circuit Boards

AU - Karady, George G.

AU - Sirkis, Murray D.

AU - Oliva, Jose R.

PY - 1991/12

Y1 - 1991/12

N2 - A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. Deterioration of the electrical interconnections and components has been observed.

AB - A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. Deterioration of the electrical interconnections and components has been observed.

UR - http://www.scopus.com/inward/record.url?scp=0026369322&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0026369322&partnerID=8YFLogxK

U2 - 10.1109/14.108161

DO - 10.1109/14.108161

M3 - Article

AN - SCOPUS:0026369322

VL - 26

SP - 1216

EP - 1219

JO - IEEE Transactions on Dielectrics and Electrical Insulation

JF - IEEE Transactions on Dielectrics and Electrical Insulation

SN - 1070-9878

IS - 6

ER -

Degrading Effect of High-altitude Corona on Electronic Circuit Boards

Abstract

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