Damage detection in integrated circuit packages using ultrasonic guided wave and clustering algorithm

Hyunseong Lee, Guoyi Li, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Reliable detection of interface delamination is important to ensure the reliability of integrated circuit packages with an efficient heat management. In this paper, a robust detection framework is developed to capture sealant delamination between the integrated heat sink and substrate. Ultrasonic guided wave is utilized as an interrogator because of its ability of detecting damages in small and complex structures. In order to efficiently interpret the ultrasonic profile, the noise is reduced through matching pursuit decomposition while minimizing unnecessary loss of information. Then, an automatic feature extraction algorithm is implemented to extract features including amplitude and time-of-arrival. Furthermore, an unsupervised machine learning algorithm, density-based spatial clustering, is utilized to interpret the extracted features and capture the delamination under different experimental condition. The detection accuracies are compared with existing inspection methods to validate the developed method, and the results from the developed method show good agreements with existing methods while maintaining a relatively high inspection efficiency.

Original languageEnglish (US)
Title of host publicationStructural Health Monitoring 2019
Subtitle of host publicationEnabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring
EditorsFu-Kuo Chang, Alfredo Guemes, Fotis Kopsaftopoulos
PublisherDEStech Publications Inc.
Pages1860-1867
Number of pages8
ISBN (Electronic)9781605956015
DOIs
StatePublished - Jan 1 2019
Event12th International Workshop on Structural Health Monitoring: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT), IWSHM 2019 - Stanford, United States
Duration: Sep 10 2019Sep 12 2019

Publication series

NameStructural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring
Volume2

Conference

Conference12th International Workshop on Structural Health Monitoring: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT), IWSHM 2019
CountryUnited States
CityStanford
Period9/10/199/12/19

ASJC Scopus subject areas

  • Computer Science Applications
  • Health Information Management

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  • Cite this

    Lee, H., Li, G., Chattopadhyay, A., Neerukatti, R. K., & Liu, K. C. (2019). Damage detection in integrated circuit packages using ultrasonic guided wave and clustering algorithm. In F-K. Chang, A. Guemes, & F. Kopsaftopoulos (Eds.), Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring (pp. 1860-1867). (Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring; Vol. 2). DEStech Publications Inc.. https://doi.org/10.12783/shm2019/32315